en English

High Temperature 3M 5413 Polyimide Film Tape for PCB Solder Masking

The 3M 5413 Polyimide Film Tape is a popular high-temperature tape made with DuPont Kapton film and silicone adhesive. It performs well in extreme temperatures from -100°F to 500°F (-73°C to 260°C), helping protect sensitive parts during heat processes. The tape is flame-retardant and resistant to chemicals, making it a reliable choice for PCB solder masking and other demanding applications. It has an amber color and a thickness of 2.7 mil (69 microns), offering both performance and a clean, professional appearance. We also offer alternative products and die-cutting services to better meet your specific needs.

High Temperature 3M 5413 Polyimide Film Tape for PCB Solder Masking

Features & Benefits:

1. Resists temperature extremes from -100°F to 500°F (-73°C to 260°C).

2. DuPont Kapton polyimide film stays stable and does not soften at high temperatures.

3. Provides an excellent release surface during high-temperature processes.

4. Maintains dimensional stability at high temperatures to help reduce rework.

5. Offers flame resistance and resists chemicals and radiation to protect surfaces.

6. Silicone adhesive resists high temperatures and reduces adhesive transfer.

7. Low adhesive transfer means less cleaning and improved productivity.

8. Uses a polyethylene tape core instead of cardboard for better durability and cleanliness.

 

Basic Specifications:

Color Amber
Backing Dupont Kapton Polyimide Film
Adhesive Silicone
Thickness 2.7 mil (0.07 mm)
Standard Roll Length 33 m (36yd)
Working Temperature range -73° to 260°C (-100° to 500°F)
Density(kg/m) 1420±20
Tensile Strength(MD/TD) ≥135 Mpa/≥115 Mpa
Elongation at Break(MD/TD) ≥35%
Surface Resistivity 200℃ ≥1.0*1013Ω
Frequency Electric Strength ≥120MV/m
Volume Resistivity 200 ≥1.0*1010 Ω.m
Relative Inductivity 50HZ 3.5±0.4
Dielectric Loss Factor 50HZ ≤4.0*10-3
Shrinkage 150℃ ≤1.0%

 

Application:

* Mask for protection of gold fingers of printed circuit boards during wave solder or solder dip process.

* Release surface in fabrication of parts cured at elevated temperatures.

3m 5413 application

Leave Your Message

Related Products

Get A Quick Quoting And Sample