Sony D3450 / D3451 is a thermosetting double-sided adhesive tape designed for FPC stiffener applications. It features a substrate-free structure with a modified acrylic adhesive layer sandwiched between a release liner and a release paper. The tape provides good initial tack for easy positioning and uses a fast-curing system to achieve secure bonding in a short time. With excellent heat resistance and reflow soldering compatibility, it is ideal for attaching stiffeners such as FR4, polyimide, aluminum, or stainless steel in high-temperature FPC processes. D3450 offers stronger adhesion, while D3451 is thinner and better suited for applications requiring reduced thickness. Custom widths, die-cutting, and replacement option are available.
1. Excellent heat resistance after moisture absorption; ideal for reflow soldering and high-temperature bonding processes.
2. Short curing time allows faster processing and increased productivity.
3. Substrate-free construction with thin and uniform adhesive layer supports thin and lightweight product designs.
4. Good initial tack enables easy positioning during assembly.
5. Strong adhesion to various materials such as PET, FR4, polyimide (PI), aluminum, and stainless steel.
6. Room temperature storage—no refrigeration required, ensuring easy handling and logistics.
7. Compatible with vacuum laminators, quick press machines, and roller press systems.
| Product name | D3451 | D3450 |
| Main component | Acrylic/Epoxy base | Acrylic/Epoxy base |
| Carrier | Non-carrier | Non-carrier |
| Color | White | White |
| Adhesive thickness(μm) | About 25 | About 35 |
| Release film thickness (um) | About 38 | About 38 |
| Release paper thickness(μm) | About 130 | About 130 |
| Bonding strength(N/10mm) | 25 | 31 |
| St’d size(width& length) | 500mm x100m | 500mm x100m |
| Warranty period from manufacturing date | 6 months | 6 months |
| Recommended curing conditions: | 1.Quick press (Temperature / 160°C to 180°C Time/1 min to 2 min(vacuum time / 10 sec to 30 sec), Pressure/1MPa to 2MPa)→Oven curing (60 min at 140°C). 2.Press(160°C, 60 min, 3MPa) |
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* Suitable for bonding of backing materials and terminals in flexible circuit assemblies.
* Ideal for attaching FPC stiffeners, such as glass epoxy or polyimide, that require heat processing (e.g., reflow soldering).
* Applicable to specialty cards requiring heat-bonding of plastic and metal layers, such as metal cards, biometric cards, and dynamic CVV cards.
GBS Die Cut, as adhesive tape supplier, focuses on the research & development, production and sales of various types of adhesive tapes for different industries and has been authorized as golden distributor of many noted brands for so many years, such as Nomex, Formex, Rogers Poron, 3M, Tesa, and so forth.
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